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Altium Designer Pick and Place Locations
C:\Users\trim_ni\Nextcloud\19. Projects\00. Altium Projects\00. Projects\01. Personal\00. MicroMod Boards\Micromod_ESP32C3\Project Outputs for Micromod_ESP32C3_Board\Pick Place\Pick Place for MicroMod_ESP32C3_board(w_IntFlash).txt
========================================================================================================================
File Design Information:
Date: 21/08/23
Time: 19:01
Revision: 7208bff5f00039f88e2a6679eb083f7ea373206c
Variant: w/IntFlash
Units used: mil
Designator Comment Layer Footprint Center-X(mil) Center-Y(mil) Rotation Description
X500 BH254VS-10P TopLayer HDR-SMD_10P-P1.27-V-M-R2-C5-S1.27-LS5.5 679.134 604.331 180 "CORTEX Debug, 1.27mm SWD Connector"
X401 32.768kHz TopLayer OSC-SMD_2P-L1.6-W1.0 0.000 303.150 90 "32.768kHz 12.5pF ±20ppm SMD1610-2P Crystals ROHS"
LED400 SK6805-EC15 TopLayer LED-SMD_4P-L1.5-W1.5-BL 773.660 808.607 0 ""
L300 2n2 TopLayer 0402_L 122.047 543.307 0 "Inductor SMD 0402"
C411 100nF TopLayer 0402_C 181.102 251.969 90 "Chip capacitors"
C410 10pF TopLayer 0402_C 53.538 330.709 90 "Chip capacitors"
C301 3.3pF TopLayer 0402_C 66.929 562.992 270 "Chip capacitor"
C300 3.3pF TopLayer 0402_C 177.165 562.992 270 "Chip capacitor"
AE300 2450AT18A100E TopLayer ANT-SMD_L3.2-W1.6 19.685 740.158 90 ""
X400 40MHz TopLayer XTAL_2520 374.016 704.724 180 "Crystal SMD 2520"
U400 ESP32-C3FN4 TopLayer QFN32-5X5 354.331 406.547 0 "Ultra­Low­Power SoC with RISC­V Single­Core CPU Supporting IEEE 802.11b/g/n (2.4 GHz Wi­Fi) and Bluetooth® 5 (LE)"
R406 10K TopLayer 0402_R 486.220 248.031 90 "Chip resistor"
R405 10K TopLayer 0402_R 141.732 251.969 270 "Chip resistor"
R404 0R TopLayer 0402_R 685.039 807.087 270 "Chip resistor"
R401 22R TopLayer 0402_R 98.425 385.827 180 "Chip resistor"
R400 22R TopLayer 0402_R 322.835 570.866 90 "Chip resistor"
L400 2n2 TopLayer 0402_L 133.858 464.567 0 "Inductor SMD 0402"
J1 MICROMOD-2222 TopLayer M.2-CARD-E-22 390.890 438.469 0 "MicroMod Connector Description: A card edge connector and mating PCB connector to allow various MicroMod Processor Boards to be coupled with various carrier boards of different capabilities. Based on the M.2 standard."
C409 10pF TopLayer 0402_C 53.538 255.905 90 "Chip capacitors"
C408 10pF TopLayer 0402_C 425.197 625.984 0 "Chip capacitors"
C407 10pF TopLayer 0402_C 346.457 625.984 180 "Chip capacitors"
C406 100nF TopLayer 0402_C 525.591 248.031 90 "Chip capacitors"
C405 100nF TopLayer 0402_C 267.716 224.409 0 "Chip capacitors"
C404 100nF TopLayer 0402_C 251.969 543.307 0 "Chip capacitors"
C403 100nF TopLayer 0402_C 251.969 582.677 0 "Chip capacitors"
C402 10uF TopLayer 0603_C 35.433 433.071 90 "Chip capacitors"
C401 100nF TopLayer 0402_C 78.740 444.882 90 "Chip capacitors"
C400 100nF TopLayer 0402_C 185.039 444.882 90 "Chip capacitors"
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