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Ayberk Özgür 2019-08-18 17:25:16 +02:00
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@ -3,21 +3,39 @@ jlcpcb-design-rules-stackups
JLCPCB design rules and stackups for Altium Designer. JLCPCB design rules and stackups for Altium Designer.
Design rules include: Design rules
------------
- **2 layer** - 2 layer
- **1 oz copper**: 5mil trace & clearance, 0.3mm hole, 0.6mm via diameter, 0.25mm hole clearance - 1 oz copper
- **2 oz copper**: 8mil trace & clearance, 0.3mm hole, 0.6mm via diameter, 0.25mm hole clearance - 5mil trace with & clearance
- **4 layer** - 0.3mm min. hole diameter
- **1 oz copper** on top & bottom layers: 3.5mil trace & clearance on all layers, 5mil via clearance, 0.2mm hole, 0.45mm via diameter, 0.25mm hole clearance - 0.6mm min. via diameter
- **2 oz copper** on top & bottom layers: 3.5mil trace & clearance on mid layers, 5mil via clearance, 8mil trace & clearance on top & bottom layers, 0.2mm hole, 0.45mm via diameter, 0.25mm hole clearance - 0.25mm hole clearance
- **6 layer** - 2 oz copper
- **1 oz copper** on top & bottom layers: 3.5mil trace & clearance on all layers, 5mil via clearance, 0.2mm hole, 0.45mm via diameter, 0.25mm hole clearance - 8mil trace width & clearance
- **2 oz copper** on top & bottom layers: 3.5mil trace & clearance on mid layers, 5mil via clearance, 8mil trace & clearance on top & bottom layers, 0.2mm hole, 0.45mm via diameter, 0.25mm hole clearance - 0.3mm min. hole diameter
- 0.6mm min. via diameter
- 0.25mm hole clearance
- 4 layer / 6 layer
- 1 oz copper on top & bottom layers, 0.5 oz copper on mid layers
- 3.5mil trace width & clearance on all layers
- 0.2mm min. hole diameter
- 0.45mm min. via diameter
- 5mil via clearance
- 0.25mm hole clearance
- 2 oz copper on top & bottom layers, 0.5 oz copper on mid layers
- 3.5mil trace width & clearance on mid layers
- 8mil trace width & clearance on top & bottom layers
- 0.2mm min. hole diameter
- 0.45mm min. via diameter
- 5mil via clearance
- 0.25mm hole clearance
All design rules include a `PowerPads` pad class for easy direct polygon pour connection. All design rules include a `PowerPads` pad class for easy direct polygon pour connection.
Layer stackups include: Layer stackups
--------------
- 2 layer - 2 layer
- 1 oz copper - 1 oz copper
@ -42,7 +60,8 @@ Layer stackups include:
- 2 oz copper on top & bottom layers - 2 oz copper on top & bottom layers
- 1.6mm, 2.0mm - 1.6mm, 2.0mm
Information compiled from: References
----------
- https://jlcpcb.com/capabilities/Capabilities - https://jlcpcb.com/capabilities/Capabilities
- https://jlcpcb.com/client/index.html#/impedance - https://jlcpcb.com/client/index.html#/impedance